Legrand Romania A.I CyberSecurity Scoring
04/01/2026
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for Legrand Romania in 2026.
No incidents recorded for Legrand Romania in 2026.
No incidents recorded for Legrand Romania in 2026.
Founded in 1961, WEG is a global electro-electronic equipment company, operating in the capital goods sector a with focus on electric motors, gearboxes and drives and controls, energy generation and transformers, electrification products and systems, automation and digitalization. WEG stands out in innovation by constantly developing solutions to meet the major trends in energy efficiency, renewable energy and electric mobility. With manufacturing units in 15 countries and present in more than 135 countries, the company has more than 47,000 employees worldwide. WEG’s net revenue reached R$ 38.0 billion in 2024, 57.0% from external markets.
Dyson solves real-world problems and creates better products through the application of engineering, science, design and creativity. It is a family-owned, global technology company, founded by Sir James Dyson who remains at the helm alongside his son Jake. Since inventing the first cyclonic bagless vacuum cleaner, the DC01, Dyson has consistently invested in research and development to improve its products and technologies radically. Dyson offers products across a growing range of areas: floorcare, air purification, robotics, haircare including formulations, lighting, hand drying, and most recently audio. Dyson continues to expand into new areas. Today, Dyson sells products in more than 80 markets, has 450 Dyson stores worldwide and is available in all major technology and beauty retailers. Dyson has global headquarters in Singapore and major technology campuses in Singapore, the UK, Malaysia, and the Philippines. Its global team of engineers, scientists and software developers are focused on developing technology-enabled products which work better and which people love to use. Key areas of focus have included high-speed electric digital motors, sensing and vision systems, robotics, machine learning and aerodynamics. Beyond products, to encourage an inventive future, Dyson is also inspiring the next generation of engineers and inventors through the Dyson Institute of Engineering and Technology, the James Dyson Foundation and the James Dyson Award. The Dyson family applies its problem-solving approach in other fields, and established Dyson Farming in 2012. It is one of the largest farming businesses in the UK, extending to 36,000 acres across Lincolnshire, Oxfordshire, Gloucestershire and Somerset. It is a family-owned enterprise unlike any other, focussed on long-term investment in British farming and the countryside to grow tasty and nutritious food.
Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) (2317: Taiwan) is the world’s largest electronics manufacturer. Foxconn is also the leading technological solution provider, and it continuously leverages its expertise in software and hardware to integrate its unique manufacturing systems with emerging technologies. By capitalizing on its expertise in Cloud Computing, Mobile Devices, IoT, Big Data, AI, Smart Networks, and Robotics / Automation, the Group has expanded not only its capabilities into the development of electric vehicles, digital health and robotics, but also three key technologies –AI, semiconductors and new-generation communications technology – which are key to driving its long-term growth strategy and the four core product pillars: Consumer Products, Enterprise Products, Computing Products and Components and Others. In 2021, Hon Hai's annual revenue reached NT$5.99 trillion. The company has established R&D and manufacturing centers in other markets around the world including China, India, Japan, Vietnam, Malaysia, Czech Republic, U.S. and more. With a focus on research and development, the company owns more than 54,253 patents. In addition to maximizing value-creation for customers who include many of the world’s leading technology companies, Foxconn is also dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practices model for global enterprises. The company has received widespread international accolades and recognition since its establishment. The company ranked 22nd on the Fortune Global 500 rankings in 2021 and 25th in the Top 100 Digital Companies in the Forbes ranking of the World’s Best Employers in 2019. Moreover, on Forbes’ World’s Best Employers 2021 rankings, the company ranked 1st in Taiwan. Foxconn is also the only Taiwanese private company awarded for 5 consecutive years of Clarivate Top 100 Global Innovators (2018 - 2022).
Vertiv is a global leader in critical digital infrastructure for applications in data centers, communication networks, and commercial and industrial environments. As businesses, industries, and communities become more connected, we pioneer and deliver end-to-end power and cooling technologies to help our customers stay resilient, optimized, and future-ready. With our industry-leading innovative technologies and global services network, we are fueling the revolution of the digital world - keeping technology ecosystems running efficiently and without interruption. Vertiv is supercharging data’s potential; accelerating the pace of technology, raising the bar for accelerated compute and redefining the limits of densification. The world depends on data we power and cool™
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence and more. Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS.
Flex (Reg. No. 199002645H) is the global manufacturing partner of choice that helps leading brands design, build, and manage products that improve the world. For more information, visit flex.com. We love to hear your thoughts, comments and ideas so feel free to like, share and comment away. Any question or opinion is good to go as long as it is respectful and falls within the scope of this page. Derogatory comments, spam and unsolicited selling are not welcome here and such posts will be removed.
Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporationprovides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.
Molex makes a connected world possible by enabling technologies that transform the future and improve lives. With a presence in more than 40 countries, Molex offers a complete range of connectivity products, services and solutions for the data communications, medical, industrial, automotive and consumer electronics industries. We’re doing more than developing solutions for our customers, we’re Creating Connections for Life.
TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads, software and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics, and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2025, TDK posted total sales of USD 14.4 billion and employed about 105,000 people worldwide.
Latest updates, reports, and threat intel affecting the global network.
A vulnerability in keras-team/keras version 3.15.0 allows unsafe deserialization of attacker-controlled PyTorch pickle data through the public `keras.layers.TorchModuleWrapper.from_config` method. This method invokes `torch.load(..., weights_only=False)` without requiring an explicit unsafe opt-in, such as a `safe_mode=False` parameter. When called outside a `SafeModeScope(True)` context, the absence of an ambient safe mode state permits unsafe deserialization by default. This issue can lead to arbitrary code execution if untrusted Keras layer configurations are processed using this method. The vulnerability arises because the method does not enforce safe deserialization practices unless explicitly guarded by Keras safe mode.
In the Linux kernel, the following vulnerability has been resolved: iommu/amd: Remove latent out-of-bounds access in IOMMU debugfs In iommu_mmio_write() and iommu_capability_write(), the variables dbg_mmio_offset and dbg_cap_offset are declared as int. However, they are populated using kstrtou32_from_user(). If a user provides a sufficiently large value, it can become a negative integer. Prior to this patch, the AMD IOMMU debugfs implementation was already protected by different mechanisms. 1. #define OFS_IN_SZ 8 ensures the user string <= 8 bytes, so e.g. 0xffffffff isn't a valid input. if (cnt > OFS_IN_SZ) return -EINVAL; 2. Implicit type promotion in iommu_mmio_write(), dbg_mmio_offset is int and iommu->mmio_phys_end is u64 if (dbg_mmio_offset > iommu->mmio_phys_end - sizeof(u64)) return -EINVAL; 3. The show handlers would currently catch the negative number and refuse to perform the read. Replace kstrtou32_from_user() with kstrtos32_from_user() to parse the input, and check for negative values to explicitly prevent out-of-bounds memory accesses directly in iommu_mmio_write() and iommu_capability_write().
In the Linux kernel, the following vulnerability has been resolved: sysfs: don't remove existing directory on update failure When sysfs_update_group() is called for a named group and create_files() fails (e.g. -ENOMEM), internal_create_group() calls kernfs_remove(kn) on the group directory. In the update path, kn was obtained via kernfs_find_and_get() and refers to a directory that already existed before this call. Removing it silently destroys a sysfs group that the caller did not create. Only remove the directory if we created it ourselves. On update failure the directory remains as it is left empty by remove_files() inside create_files(), but can be repopulated by a retry.
In the Linux kernel, the following vulnerability has been resolved: mm/damon/sysfs-schemes: call missing mem_cgroup_iter_break() damon_sysfs_memcg_path_to_id() breaks mem_cgroup_iter() loop without calling mem_cgroup_iter_break(). This leaks the cgroup reference. Fix the issue by calling mem_cgroup_iter_break() before the break. The issue was discovered [1] by Sashiko.
In the Linux kernel, the following vulnerability has been resolved: efi: Allocate runtime workqueue before ACPI init Since commit 5894cf571e14 ("acpi/prmt: Use EFI runtime sandbox to invoke PRM handlers") ACPI PRM calls are delegated to a workqueue which runs in a kernel thread, making it easier to detect and mitigate faulting memory accesses performed by the firmware. Rafael reports that such PRM accesses may occur before efisubsys_init() executes, which is where the workqueue is allocated, leading to NULL pointer dereferences. Since acpi_init() [which triggers the early PRM accesses] executes as a subsys_initcall() as well, and has its own dependencies that may be sensitive to initcall ordering, deferring acpi_init() is not an option. So instead, split off the workqueue allocation into its own postcore initcall, as this is the only missing piece to allow EFI runtime calls to be made. This ensures that EFI runtime call (including PRM calls) are accessible to all code running at subsys_initcall() level.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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