AKM A.I CyberSecurity Scoring
01/04/2026
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for Asahi Kasei Microdevices (AKM) in 2026.
No incidents recorded for Asahi Kasei Microdevices (AKM) in 2026.
No incidents recorded for Asahi Kasei Microdevices (AKM) in 2026.
ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices. By getting more from technology to get more from life, ST stands for life.augmented.
Who are we? ASML is an innovation leader in the global semiconductor industry. We make machines that chipmakers use to mass produce microchips. Founded in 1984 in the Netherlands with just a handful of employees, we’ve now grown to over 40,000 employees, 143 nationalities and more than 60 locations around the world. What do we do? We provide chipmakers with hardware, software and services to mass produce patterns on silicon through lithography. Our lithography systems use ultraviolet light to create billions of tiny structures on silicon that together make up a microchip. We push our technology to new limits to enable our customers to create smaller, faster and more powerful chips. Who are our people? While you may think that only engineers and mathematicians work at ASML, you'll be surprised to find out that our people come from a wide variety of backgrounds. Across ASML, we have dedicated teams that manage customer support, communications and media, IT, software development and more. Every team in the company is essential for pushing our technology and the industry forward. If you love to tackle challenges and innovate in a collaborative, supportive and inclusive environment with all the flexibility and freedom to unleash your full potential, ASML is the place to be. Join us!
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Learn more about onsemi at www.onsemi.com.
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that help drive advancements in automation and robotics, mobility, energy and data centers, and healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X (formerly Twitter).
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information. ALERT: MediaTek, along with other companies, have been the victim of unscrupulous individuals fraudulently purporting to be recruiters by fabricating job descriptions and extending spurious offers of employment in an effort to obtain sensitive personal information. We are currently working with authorities to investigate all wrong doings. If you believe you have been a victim, please contact [email protected]. Any interested candidates for worldwide positions at MediaTek are asked to apply only through mediatek.com, or via the applicable posting directly on LinkedIn.
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
Latest updates, reports, and threat intel affecting the global network.
TOKYO, February 19, 2026--(BUSINESS WIRE)--Asahi Kasei Microdevices Corporation (AKM) has announced that its commercialization of thin-film...
AKM and Austrian research center Silicon Austria Labs (SAL) have completed a joint proof of concept for integrating a current sensor into a power module.
Asahi Kasei Microdevices Corporation (AKM) and Silicon Austria Labs GmbH (SAL) has completed a joint proof of concept of the eFuse.
Asahi Kasei Microdevices (AKM) has launched a new DC-DC step-up converter with ultra-low power consumption that is able to boost low...
tls_opt_dtls_peer_connection_id_value_get() in subsys/net/lib/sockets/sockets_tls.c, which handles getsockopt(SOL_TLS, TLS_DTLS_PEER_CID_VALUE), passed the caller-supplied optval directly to mbedtls_ssl_get_peer_cid() without verifying the buffer was at least MBEDTLS_SSL_CID_OUT_LEN_MAX (default 32) bytes. mbedtls_ssl_get_peer_cid() copies the peer-negotiated DTLS Connection ID (length 1..MBEDTLS_SSL_CID_OUT_LEN_MAX) into that buffer without a destination-size parameter, so a caller-supplied optlen smaller than the CID causes a write of up to 31 bytes past the buffer end. In CONFIG_USERSPACE builds the getsockopt syscall verifier (z_vrfy_zsock_getsockopt) bounce-buffers the user's optval into a kernel allocation of exactly optlen bytes (k_usermode_alloc_from_copy -> z_thread_malloc), so an unprivileged user thread that passes a small optlen on a connected DTLS socket with Connection ID enabled induces a kernel-heap buffer overflow, with the overflowing content being the remote peer's CID. The defect requires CONFIG_MBEDTLS_SSL_DTLS_CONNECTION_ID, an established DTLS session with a negotiated peer CID, and (for the kernel-crossing case) CONFIG_USERSPACE. Introduced when the TLS_DTLS_CID option was added (v3.5.0). The fix rejects callers whose optlen is below MBEDTLS_SSL_CID_OUT_LEN_MAX with -EINVAL.
react18-use is a React 19 use hook shim. Between 2026-05-19 01:07:01 and 2026-05-19 15:20:43, the default branch contained malicious commits 7b79148d1495a2505f9277da295a98cf176f4496 through 7b79148d1495a2505f9277da295a98cf176f4496 that executed remote attacker-controlled code on developer machines during `npm install`. The commits were removed by force-push, but local clones, forks, and direct-SHA URLs may still contain them, and `npm install` against an affected checkout will still execute the code today. The package was not published to npm. `src/install.js` was added and wired into the `postinstall` script. It fetched a JavaScript payload from an attacker-controlled HTTPS endpoint (configurable via an environment variable), disabled TLS verification, and evaluated the response as code with `require` available. Execution was deliberately skipped on CI and cloud/serverless environments, targeting developer workstations. The second-stage payload was attacker-hosted and cannot be reconstructed. Assume full compromise of anything reachable from a Node process with the user's permissions. Those who ran `npm install` against an affected checkout on a developer machine on or after 2026-05-19 01:07:01 should treat the machine as compromised, rotate every credential the machine could reach, audit account activity since 2026-05-19 01:07:01, and clean local clones.
The UpdateHub management subsystem (subsys/mgmt/updatehub/updatehub.c) drives every update operation through a single file-scope ctx structure that holds the CoAP block context, payload buffer, status code, socket, and a one-element poll-fd array fds[1]. Access to ctx was not serialized, and prepare_fds() wrote ctx.fds[ctx.nfds] and incremented ctx.nfds with no bounds check. Two independent paths mutate ctx concurrently: the background autohandler running on the system workqueue, and user-triggered operations reached through the updatehub run shell command, direct API calls, or — since the operations are exposed as syscalls — userspace threads. When a second flow enters prepare_fds() while ctx.nfds is already 1, the write lands one element past the array; by struct layout it overlaps the adjacent ctx.sock/ctx.nfds members. More broadly, the unsynchronized sharing lets two flows interleave connection setup and teardown, double-closing a socket descriptor or scribbling the shared buffers. The result is corruption of the update subsystem's internal state and denial of service of the firmware-update path; the out-of-bounds write is contained within the ctx structure and there is no demonstrated path to memory outside it or to code execution. Triggering requires a local actor able to invoke update operations (or, with CONFIG_USERSPACE, an unprivileged userspace thread) and to win a timing race against the background handler; remote peers cannot control the race timing. The fix serializes the entry points with a mutex and adds a bounds check to prepare_fds().
The UpdateHub over-the-air update client's start_coap_client() in subsys/mgmt/updatehub/updatehub.c leaks the CoAP/DTLS socket descriptor on its connection-setup failure paths. The shared error: cleanup gated socket closing on a ret > 0 flag, but ret was set to -1 immediately after the socket was created, so when zsock_setsockopt() (DTLS) or zsock_connect() subsequently failed the gate was false and cleanup_connection() was never called. The open descriptor in the global ctx.sock was then overwritten by the next attempt, permanently leaking it from the socket / net_context pool until reboot. The failing setup path is reached every time the OTA client tries to contact the UpdateHub server and the connection cannot be established — driven automatically by the periodic autohandler() poll (and on demand via the updatehub_probe()/updatehub_update() API or the updatehub run shell command). The DTLS handshake/connect outcome is influenceable by a network or on-path attacker who drops, resets, or otherwise disrupts traffic to the server, and also fails naturally whenever the server is unreachable. Each failed attempt permanently leaks one descriptor; once the shared socket pool is exhausted, networking degrades device-wide until the device is rebooted, a denial-of-service condition. Severity is low because the leak rate is bounded by the configured OTA poll interval (default once per 24 hours), the effect is gradual and recovered by reboot, and only builds with the UpdateHub client enabled are affected. There is no memory-corruption, information-disclosure, or authentication impact.
Certain web interface components in affected TP-Link Aginet devices do not validate and sanitize user-supplied input properly before passing it to system-level command execution functions. An authenticated adjacent attacker may inject specially crafted input to execute arbitrary operation system commands with elevated privileges. Successful exploitation may allow execution of arbitrary system commands, potentially leading to full device compromise.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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