NEN A.I CyberSecurity Scoring
19/01/2026
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for NeXt exPerience @ NXP in 2026.
No incidents recorded for NeXt exPerience @ NXP in 2026.
No incidents recorded for NeXt exPerience @ NXP in 2026.
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that help drive advancements in automation and robotics, mobility, energy and data centers, and healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X (formerly Twitter).
Applied Materials is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. We look forward to engaging with you on compelling topics about the semiconductor industry. We want to hear from you, but offensive comments that create an unpleasant environment for our community will be removed. Thanks for your understanding.
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Visit us at: www.kla.com Statements made on LinkedIn may constitute forward-looking statements under federal securities laws. These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA faces include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q. Forward-looking statements made by third parties do not necessarily reflect the opinion of KLA, are outside of KLA’s control and have not been verified or otherwise vetted by KLA.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_
Established in 1974 as a subsidiary of Samsung Electronics, we’re proud to be recognized as one of the leading chip manufacturers in the world. Using our knowledge in semiconductor technology, our ambition is to spark the imagination of device manufacturers with top-of-the-line building blocks and, through that, enrich the lives of people around the world with transformative solutions.
Who are we? ASML is an innovation leader in the global semiconductor industry. We make machines that chipmakers use to mass produce microchips. Founded in 1984 in the Netherlands with just a handful of employees, we’ve now grown to over 40,000 employees, 143 nationalities and more than 60 locations around the world. What do we do? We provide chipmakers with hardware, software and services to mass produce patterns on silicon through lithography. Our lithography systems use ultraviolet light to create billions of tiny structures on silicon that together make up a microchip. We push our technology to new limits to enable our customers to create smaller, faster and more powerful chips. Who are our people? While you may think that only engineers and mathematicians work at ASML, you'll be surprised to find out that our people come from a wide variety of backgrounds. Across ASML, we have dedicated teams that manage customer support, communications and media, IT, software development and more. Every team in the company is essential for pushing our technology and the industry forward. If you love to tackle challenges and innovate in a collaborative, supportive and inclusive environment with all the flexibility and freedom to unleash your full potential, ASML is the place to be. Join us!
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization. As a global semiconductor leader in power systems and IoT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow. Together, with more than 58,000 people from over 100 countries, we are not just shaping the future. We are redefining it. We engineer innovative products, while caring for our people and empowering them to reach ambitious goals. We offer work-life balance, long term growth and a supportive environment where individuality is celebrated. #WeAreIn for driving decarbonization and digitalization. Are you in?
Latest updates, reports, and threat intel affecting the global network.
During Computex 2025, NXP not only featured a keynote speech on edge AI development by Jens Hinrichsen, executive vice president and general...
Volkswagen will debut the first automotive application of ultra-wide-band wireless communications using technology from NXP later this year.
A security vulnerability has been detected in Rizwan17 inventory-management-system up to bfe78a330d01bb26b9daec5dc9ecd5c77900e03f. This affects an unknown part of the file includes/invoice_bill.php of the component Invoice Generation. Such manipulation of the argument order_date/invoice_no leads to missing authentication. It is possible to launch the attack remotely. The exploit has been disclosed publicly and may be used. This product takes the approach of rolling releases to provide continious delivery. Therefore, version details for affected and updated releases are not available. The project was informed of the problem early through an issue report but has not responded yet.
A weakness has been identified in Rizwan17 inventory-management-system up to bfe78a330d01bb26b9daec5dc9ecd5c77900e03f. Affected by this issue is some unknown functionality of the file includes/DBOperation.php of the component List Handler. This manipulation of the argument category_name/brand_name/product_name causes cross site scripting. It is possible to initiate the attack remotely. The exploit has been made available to the public and could be used for attacks. This product is using a rolling release to provide continious delivery. Therefore, no version details for affected nor updated releases are available. The project was informed of the problem early through an issue report but has not responded yet.
Authentication Bypass via Hardcoded Master Verification Code vulnerability in Siam Ordering (siam-server) 1.0.0 allows remote unauthenticated attackers to log in as any user, merchant, or administrator.
The Bluetooth Classic (BR/EDR) L2CAP receive handler bt_l2cap_br_recv() in subsys/bluetooth/host/classic/l2cap_br.c dispatched inbound data PDUs based only on the destination channel ID, without checking that the target channel had reached the BT_L2CAP_CONNECTED state. A dynamic channel is assigned its RX CID and added to the connection's channel list while still in BT_L2CAP_CONNECTING (and later BT_L2CAP_CONFIG) — before configuration completes and, for PSMs that require security, before the peer is authenticated (l2cap_br_conn_req()). Because the channel is already findable by bt_l2cap_br_lookup_rx_cid() during this window, a remote peer within radio range can send a data PDU addressed to that CID and have it processed on a not-yet-established channel. The dispatch keys off channel fields (BR_CHAN(chan)->rx.mode, rx.mps) that are only initialized during configuration by l2cap_br_conf(); since channel objects are pooled and bt_l2cap_br_chan_del() does not reset rx.mode or the reassembly buffer _sdu, a reused channel can carry stale state into the CONNECTING window and route the frame into the retransmission/flow-control path (bt_l2cap_br_ret_fc_recv()) with stale parameters and a possibly stale _sdu pointer. The impact is delivery of attacker data to upper-layer protocol handlers on a half-open (and possibly unauthenticated) channel, plus operation on stale or partially initialized channel state on reused channel objects — leading to channel/link teardown (denial of service) and, in the stale-_sdu case, a dangling-pointer condition. The fix adds an explicit BR_CHAN(chan)->state < BT_L2CAP_CONNECTED guard that drops any data received before the channel is fully connected.
Pandora contains a path traversal vulnerability in its archive extraction worker. When processing a specially crafted archive or disk image, attacker-controlled file paths could be used without ensuring that the resulting destination remained within the intended extraction directory. An attacker able to submit a malicious file for analysis could use path traversal sequences or crafted paths to cause extracted content to be written outside the designated extraction directory, potentially overwriting files accessible to the Pandora worker process. Successful exploitation could result in unauthorized modification of application or system files, denial of service, and potentially further compromise depending on the permissions of the Pandora process and the files that can be overwritten. The vulnerability is addressed by resolving each extraction destination path before writing and verifying that it remains below the expected extraction directory. Extraction attempts resolving outside this directory are rejected and reported as path traversal attempts.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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