DST A.I CyberSecurity Scoring
27/10/2025
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for DuPont Semiconductor Technologies in 2026.
No incidents recorded for DuPont Semiconductor Technologies in 2026.
No incidents recorded for DuPont Semiconductor Technologies in 2026.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com. The content on our LinkedIn page may contain AI-generated imagery, performers and/or audio.
Established in 1974 as a subsidiary of Samsung Electronics, we’re proud to be recognized as one of the leading chip manufacturers in the world. Using our knowledge in semiconductor technology, our ambition is to spark the imagination of device manufacturers with top-of-the-line building blocks and, through that, enrich the lives of people around the world with transformative solutions.
ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices. By getting more from technology to get more from life, ST stands for life.augmented.
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
We anticipate tomorrow’s needs—navigating a changing world by bringing together technology's brightest minds to build game-changing solutions that propel us forward. NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.61 billion in 2024. Find out more at www.nxp.com. Career Development Opportunities : Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. GlobalFoundries is an Equal Employment Opportunity/Affirmative Action (EEO/AA) employer.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
Latest updates, reports, and threat intel affecting the global network.
Revenue for the global IC design industry in Q1 2025 rose 6% QoQ to US$77 billion, a new record that was fueled by early stocking ahead of US tariffs.
Revolutionary embedded barrier technology transforms semiconductor production, boosting yields and cutting defects.
The ISO/SAE 21434 standard focuses on cybersecurity for road vehicles. Cars are getting smarter, more complicated, and more vulnerable to cyberattacks.
STMicroelectronics, for example, is partnering with DuPont and Kernel, demonstrating that cross-industry innovation is key to tackling complex health...
DuPont has announced a plan to separate into three distinct, publicly traded companies. Under the plan, DuPont would execute the proposed separations of its...
TSMC is dedicated to fulfilling the commitments of its "Information Security Declaration". In response to the Company's development toward...
Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a...
Deserialization of untrusted data in Microsoft Edge (Chromium-based) allows an unauthorized attacker to execute code over a network.
The Bluetooth BAP Broadcast Assistant GATT client in subsys/bluetooth/audio/bap_broadcast_assistant.c reassembled remote Broadcast Receive State data into a single file-static net_buf_simple (att_buf, BT_ATT_MAX_ATTRIBUTE_LEN = 512 bytes) shared by all connection instances, while the BUSY flag, long-read handle, and reset/offset state were per-connection. When the device acts as a Broadcast Assistant connected to multiple Scan Delegator peripherals, notification and long-read callbacks from different connections interleave on the shared buffer: the append in notify_handler (net_buf_simple_add_mem at the not-busy branch) performs no tailroom check, so receive-state notifications from two or more delegators accumulate on the same 512-byte buffer and, with a sufficiently large configured ATT MTU (BT_L2CAP_TX_MTU up to 2000) and two-to-three concurrent connections, write past the buffer into adjacent .bss (net_buf_simple_add only asserts in debug builds). Even below the overflow threshold, one connection's net_buf_simple_reset zeroes the shared length while another connection's reassembly and GATT read offset are in flight, mixing one peer's data into another's parse. A malicious or compromised Scan Delegator (or two colluding peers) over BLE can trigger this, causing out-of-bounds writes (memory corruption / denial of service) and cross-connection data corruption. The fix moves the buffer into the per-connection instance struct so each connection reassembles into its own buffer. Affects Zephyr releases shipping the Broadcast Assistant with the shared buffer, including v4.4.0 and earlier.
ImageMagick before 7.1.2-26 contains a memory leak vulnerability in the VIFF encoder when memory allocation fails. Attackers can trigger allocation failures by processing specially crafted VIFF images to exhaust available memory and cause denial of service.
ImageMagick before 7.1.2-26 contains a use-after-free vulnerability in the FormatMagickCaption method when memory allocation fails. Attackers can trigger memory allocation failures to cause a dangling pointer to reference freed memory, potentially enabling denial of service or code execution.
ImageMagick before 7.1.2-26 contains a policy bypass vulnerability in the APNG encoder and external delegates due to missing validation checks. Attackers can write files to disallowed paths by bypassing configured policy restrictions through the APNG encoding process.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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