AMK A.I CyberSecurity Scoring
19/03/2026
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for Applied Materials Korea in 2026.
No incidents recorded for Applied Materials Korea in 2026.
No incidents recorded for Applied Materials Korea in 2026.
ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices. By getting more from technology to get more from life, ST stands for life.augmented.
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com. The content on our LinkedIn page may contain AI-generated imagery, performers and/or audio.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Visit us at: www.kla.com Statements made on LinkedIn may constitute forward-looking statements under federal securities laws. These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA faces include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q. Forward-looking statements made by third parties do not necessarily reflect the opinion of KLA, are outside of KLA’s control and have not been verified or otherwise vetted by KLA.
Micron is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information. ALERT: MediaTek, along with other companies, have been the victim of unscrupulous individuals fraudulently purporting to be recruiters by fabricating job descriptions and extending spurious offers of employment in an effort to obtain sensitive personal information. We are currently working with authorities to investigate all wrong doings. If you believe you have been a victim, please contact [email protected]. Any interested candidates for worldwide positions at MediaTek are asked to apply only through mediatek.com, or via the applicable posting directly on LinkedIn.
Applied Materials is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. We look forward to engaging with you on compelling topics about the semiconductor industry. We want to hear from you, but offensive comments that create an unpleasant environment for our community will be removed. Thanks for your understanding.
Latest updates, reports, and threat intel affecting the global network.
Commerce Department subsidiary says ion implanters were partially assembled in Korea and shipped to blacklisted SMIC units.
The U.S. Department of Commerce on Wednesday announced a $252 million settlement with Applied Materials for illegally exporting chipmaking...
Approximately 550 companies will showcase advanced semiconductor manufacturing technologies and solutions across more than 2400 booths at...
Applied Materials (AMAT) Korea said on Wednesday it will participate in Semicon Korea 2026, held at COEX in Seoul from Feb. 11 to 13.
Applied Materials Q4 FY 2025 shows AI-driven WFE mix, new tools and services momentum, with guidance and customer visibility towards 2026.
Hackers have injected multiple popular NPM packages with crypto-stealing code in a massive supply chain attack after compromising the...
Applied Materials Expectations: AI-fueled HBM and packaging demand to support meeting consensus; guidance will drive post-earnings...
The US company's new office is in the Shalun Smart Green Energy Science City, a new AI industry base and cybersecurity hub in southern Taiwan.
The US Commerce Department is investigating whether Ronda Korea, a South Korean company, has been selling chipmaking equipment to Chinese firms.
An incomplete patch for CVE-2026-18556 allows for authentication bypass and account takeover in N-central Versions through 2026.3.1
The OCPP 1.6 client in subsys/net/lib/ocpp parsed inbound WAMP RPC frames in parse_rpc_msg() (subsys/net/lib/ocpp/ocpp_j.c) using a hand-rolled helper, extract_string_field(), that copied the message's uid and action fields with strncpy(out_buf, token + 1, outlen - 1) and then scanned the result with strchr(out_buf, '"'). Because strncpy does not NUL-terminate the destination when the source is at least outlen - 1 (127) bytes long, the subsequent strchr reads past the 128-byte destination buffer into adjacent stack memory; if a " byte is found beyond the buffer, a one-byte out-of-bounds NUL write also occurs. A related defect in extract_payload() runs strchr/strrchr over the receive buffer, which may not be NUL-terminated when a maximal-length frame fills it. The parsed bytes come directly from the OCPP central-system server over a websocket: the reader thread fills recv_buf via websocket_recv_msg() and calls parse_rpc_msg() on each inbound DATA frame (subsys/net/lib/ocpp/ocpp.c). A malicious or compromised central server, or an on-path attacker (OCPP is commonly deployed over plain ws://), can send an RPC frame whose uid or action field is 127+ bytes with no closing quote, triggering the out-of-bounds access. The primary impact is a remotely triggerable denial of service: the unbounded scan can fault on an unmapped page, and the stray NUL write can corrupt adjacent stack state. The over-read data is not reflected to the peer, so disclosure is limited. The feature is EXPERIMENTAL and must be explicitly enabled (CONFIG_OCPP). The fix replaces the manual parser with the bounds-respecting json_mixed_arr_parse() and copies the extracted uid with an explicitly NUL-terminated buffer, eliminating both over-reads.
A vulnerability in huggingface/transformers versions <=5.8.0.dev0 allows an attacker to perform arbitrary file writes via path traversal. The issue resides in the `save_pretrained()` methods of `PreTrainedTokenizerBase` and `ProcessorMixin`, where keys from the `chat_template` dictionary are used directly as filenames without proper validation. An attacker can exploit this by publishing a malicious Hugging Face Hub repository with a crafted `tokenizer_config.json` file. When a victim downloads and saves the tokenizer or processor, the attacker-controlled keys can escape the intended save directory, enabling arbitrary file writes with attacker-controlled content. This vulnerability affects multiple processors inheriting from `ProcessorMixin`, including Idefics, Florence, Gemma, Phi, and Qwen-VL.
PyAthena prior to 3.35.4 contains a sql injection vulnerability that allows unauthenticated attackers to inject arbitrary SQL by exploiting improper quote-escaping in DefaultParameterFormatter.format(), which routes DELETE and CTAS statements to the _escape_hive function that backslash-escapes single quotes rather than doubling them. Because Athena and Trino do not treat backslashes as escape characters inside string literals, attacker-supplied input such as a single quote followed by SQL syntax causes the parser to terminate the string literal prematurely, enabling data exfiltration via UNION SELECT, execution of destructive statements, and attacker-controlled CTAS destination and content.
Zephyr's Bluetooth Mesh subnet key management leaks one PSA Crypto key slot on every subnet-key teardown. In subsys/bluetooth/mesh/subnet.c, net_keys_create() imports the Private Beacon Key into a PSA key slot under CONFIG_BT_MESH_PRIV_BEACONS (enabled by default), but subnet_keys_destroy() guarded the matching psa_destroy_key() with CONFIG_BT_MESH_V1d1. That Kconfig symbol was removed when explicit Mesh 1.0.1 support was dropped, so the destroy branch became permanently dead code and the import is never balanced by a destroy. The imbalanced teardown is reached every time subnet keys are destroyed: deleting a subnet (Config Server NetKey Delete), completing a Key Refresh Procedure (which retires the old key set), and resetting/re-provisioning the node. The over-the-air triggers are processed only under the node's device key, so they are exercisable by the provisioner or network administrator that owns the node, reachable over the Bluetooth Mesh network. With the default CONFIG_MBEDTLS_PSA_KEY_SLOT_COUNT of 16, repeated add/delete or key-refresh cycles exhaust the shared PSA key-slot pool after roughly a dozen rounds. Once exhausted, bt_mesh_private_beacon_key() and thus subnet creation fail: the node can no longer add subnets or complete key refresh, and other PSA crypto consumers on the device may be starved, until the device is rebooted. The fix aligns the destroy guard with the import guard (CONFIG_BT_MESH_PRIV_BEACONS) so each slot is freed.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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