ams OSRAM A.I CyberSecurity Scoring
02/04/2026
Access Monitoring Plan
Access Monitoring Plan
No incidents recorded for ams OSRAM in 2026.
No incidents recorded for ams OSRAM in 2026.
No incidents recorded for ams OSRAM in 2026.
Semiconductor Manufacturing
We are a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Applied Materials is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. We look forward to engaging with you on compelling topics about the semiconductor industry. We want to hear from you, but offensive comments that create an unpleasant environment for our community will be removed. Thanks for your understanding.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
Broadcom provides semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. We combine long-term R&D investment with superb execution to deliver the best technology, at scale. Through focus and expertise, Broadcom sets the standard in industries where technology breakthroughs shape markets. Our semiconductor and semiconductor-based solutions serve markets across networking connectivity, wireless device connectivity, servers and storage systems, broadband, and industrial. Broadcom’s infrastructure software solutions serve markets including private cloud, mainframe software, cybersecurity, enterprise software, and Fibre Channel storage area network management. With these core technologies, we help customers accelerate their innovation.
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Visit us at: www.kla.com Statements made on LinkedIn may constitute forward-looking statements under federal securities laws. These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA faces include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q. Forward-looking statements made by third parties do not necessarily reflect the opinion of KLA, are outside of KLA’s control and have not been verified or otherwise vetted by KLA.
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com. The content on our LinkedIn page may contain AI-generated imagery, performers and/or audio.
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. At Marvell, We go all in with you. Focused and determined, we unite behind your goals as our own. We leverage our unrivaled portfolio of infrastructure technology to identify the best solution for your unique needs. And we sit shoulder-to-shoulder with your teams to build it. Agile in our thinking, and our partnerships, we look for unexpected connections that deliver a competitive edge and reveal new opportunities. At Marvell, we’re driven by the belief that how we do things matters just as much as what we do. Because, with a foundation built on partnership, anything is possible.
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop
Latest updates, reports, and threat intel affecting the global network.
Tech companies have announced more than 45000 layoffs since the start of 2026, as firms across the industry restructure operations and shift...
Improper Handling of Highly Compressed Data (Data Amplification) vulnerability in elixir-grpc grpc (GRPC.Compressor.Gzip, GRPC.Message modules) allows a denial of service via a gzip decompression bomb. This vulnerability is associated with program files lib/grpc/compressor/gzip.ex, lib/grpc/message.ex and program routines 'Elixir.GRPC.Compressor.Gzip':decompress/1, 'Elixir.GRPC.Message':from_data/2. 'Elixir.GRPC.Compressor.Gzip':decompress/1 calls :zlib.gunzip/1 directly on attacker-controlled bytes with no decompressed-size limit, ratio check, or incremental decoding. Because this module is the registered gzip GRPC.Compressor implementation, it is invoked automatically whenever an incoming gRPC frame carries the grpc-encoding: gzip header. :zlib.gunzip/1 allocates the entire decompressed result as a single binary, so a small highly compressible payload (for example a few kilobytes of zeros, which gzip compresses at roughly 1000:1) expands to multiple gigabytes inside a single call. The max_receive_message_length limit is enforced only against the already-decompressed message, so it provides no protection. An unauthenticated remote peer can send a single crafted frame to exhaust the BEAM node's heap and trigger an out-of-memory kill. This issue affects grpc: from 0.4.0 before 1.0.0.
Allocation of Resources Without Limits or Throttling vulnerability in elixir-grpc grpc allows unauthenticated attackers to exhaust the BEAM's memory and crash the server by streaming a large or slow-trickle unary request body. 'Elixir.GRPC.Server.Adapters.Cowboy.Handler':read_full_body/3 (lib/grpc/server/adapters/cowboy/handler.ex) accumulates every received chunk into a single growing binary with no size cap. Additionally, when the client omits the grpc-timeout header, the per-chunk read timeout resolves to :infinity, allowing a slow-trickle client to keep the connection alive indefinitely while memory grows. A single connection is sufficient to exhaust server memory and crash the node. This issue affects grpc from 0.3.1 before 1.0.0.
Deserialization of Untrusted Data and Allocation of Resources Without Limits or Throttling vulnerabilities in elixir-grpc grpc allow unauthenticated attackers to crash the BEAM node via atom table exhaustion and, when a decoded term flows into a call site that invokes it, achieve remote code execution on the server. 'Elixir.GRPC.Codec.Erlpack':decode/2 (lib/grpc/codec/erlpack.ex) calls :erlang.binary_to_term/1 on the raw gRPC message body without the :safe option, no size bound, and no type guard. Any unauthenticated peer that sends a request with Content-Type: application/grpc+erlpack can send a crafted payload that mints arbitrary new atoms (which are never garbage-collected, exhausting the bounded atom table and crashing the VM) or that encodes a fun term which, if applied anywhere downstream, executes attacker-controlled code inside the server process. This issue affects grpc from 0.4.0 before 1.0.0.
The browserstack-cypress-cli is BrowserStack's CLI which allows users to run Cypress tests on BrowserStack. Versions prior to 1.36.4 are vulnerable to OS command injection via the cypress_config_file configuration parameter. In readCypressConfigUtil.js, the loadJsFile() function constructs a shell command by interpolating the user-controlled cypress_config_filepath value into a template literal, then executes it via child_process.execSync(). Shell metacharacters in the config path (specifically " and ;) allow breaking out of the quoted argument and injecting arbitrary commands. This issue has been fixed in version 1.36.6.
Authorization Bypass Through User-Controlled Key vulnerability in elixir-grpc grpc allows authenticated attackers to access or modify resources belonging to other users by smuggling a conflicting value for any path-bound field via the query string or request body. In 'Elixir.GRPC.Server.Transcode':map_request/5 (lib/grpc/server/transcode.ex), all three clauses use Map.merge/2 with path bindings as the first argument, giving them the lowest merge precedence. A request such as GET /users/me/profile?user_id=victim (or a POST with {"user_id": "victim"} when body: "*") yields a decoded protobuf struct where the path-bound field carries the attacker-supplied value rather than the router-extracted value. Any handler that uses the path-bound field for authorization, multi-tenancy scoping, or ownership checks is silently bypassed. This issue affects grpc from 0.8.0 before 1.0.0.
curl -i -X GET 'https://api.rankiteo.com/underwriter-getcompany-history?
linkedin_id=axa' -H 'apikey: YOUR_API_KEY_HERE'
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