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Comparison Overview

Samsung Electronics PolskaSamsung Electronics Polska
VS
TE ConnectivityTE Connectivity
Samsung Electronics Polska

Samsung Electronics Polska

Postępu 14, Warszawa, 02-676, PL

Last Update: 24/01/2026

View Profile
753/1000Fair

Samsung Electronics Polska to światowy lider w dostarczaniu nowoczesnych technologii cyfrowych wspierających biznes. Nieustannie ulepszamy Digital Signage, kanał sprzedaży profesjonalnych systemów wizualnych dla rozwojowych branż. Oferujemy innowacyjne produkty dynami...

NAICS:335
NAICS Definition:Electrical Equipment, Appliance, and Component Manufacturing
Employees:1,334
Subsidiaries:41
12-month incidents
0
Known data breaches
0
Attack type number
0
TE Connectivity

TE Connectivity

Galway, IE

Last Update: 03/04/2026

View Profile
Between 800 and 849
https://www.te.com
810/1000Good

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and da...

NAICS:335
NAICS Definition:Electrical Equipment, Appliance, and Component Manufacturing
Employees:40,483
Subsidiaries:1
12-month incidents
0
Known data breaches
0
Attack type number
0

Compliance Ranges Comparison

Based On Specific Ai Models Category
Samsung Electronics Polska

Samsung Electronics Polska

-
ISO 27001Not verified
ISO 27001
-
SOC2 Type 1Not verified
SOC2 Type 1
-
SOC2 Type 2Not verified
SOC2 Type 2
-
GDPRNot verified
GDPR
-
PCI DSSNot verified
PCI DSS
-
HIPAANot verified
HIPAA
TE Connectivity

TE Connectivity

-
ISO 27001Not verified
ISO 27001
-
SOC2 Type 1Not verified
SOC2 Type 1
-
SOC2 Type 2Not verified
SOC2 Type 2
-
GDPRNot verified
GDPR
-
PCI DSSNot verified
PCI DSS
-
HIPAANot verified
HIPAA

Benchmark & Cyber Underwriting Signals

Incidents vs Appliances, Electrical, and Electronics Manufacturing Industry Avg (This Year)

No incidents recorded for Samsung Electronics Polska in 2026.

Incidents

Incidents vs Appliances, Electrical, and Electronics Manufacturing Industry Avg (This Year)

No incidents recorded for TE Connectivity in 2026.

Incidents

Incident History - Samsung Electronics Polska (X = Date, Y = Severity)

Samsung Electronics Polska cyber incidents detection timeline including parent company and subsidiaries.

R - Ransomware
C - Cyber Attack
D - Data Breach
V - Vulnerability

Incident History - TE Connectivity (X = Date, Y = Severity)

TE Connectivity cyber incidents detection timeline including parent company and subsidiaries.

No timeline data available
R - Ransomware
C - Cyber Attack
D - Data Breach
V - Vulnerability

Notable Incidents

Last Cyber / HR Incidents / Global...
Samsung Electronics Polska

Samsung Electronics Polska

Incidents
No explicit notable incidents reported.
TE Connectivity

TE Connectivity

Incidents
No explicit notable incidents reported.

FAQ

Between Samsung Electronics Polska company and TE Connectivity company, which one has the best AI Cybersecurity Score ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced more cyber incidents in the past ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced more cyber incidents this year ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced at least one ransomware attack ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced at least one data breach ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced at least one targeted cyberattack ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has experienced at least one vulnerability ?
Between Samsung Electronics Polska company and TE Connectivity company, which one holds the most compliance certifications ?
Between Samsung Electronics Polska company and TE Connectivity company, which one holds the fewest compliance certifications ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has the most subsidiaries ?
Between Samsung Electronics Polska company and TE Connectivity company, which one has the largest number of employees ?
Between Samsung Electronics Polska and TE Connectivity, which company holds both SOC 2 Type 1 certifications ?
Between Samsung Electronics Polska and TE Connectivity, which company holds both SOC 2 Type 2 certifications ?
Which company is ISO 27001 certified - Samsung Electronics Polska or TE Connectivity ?
Which company is PCI DSS compliant - Samsung Electronics Polska or TE Connectivity ?
Between Samsung Electronics Polska and TE Connectivity, which company complies with HIPAA regulations for healthcare data ?
Between Samsung Electronics Polska and TE Connectivity, which company complies with GDPR requirements ?

Latest Global CVEs

CVE-2026-67866
SUMMARY

Buffer Overflow vulnerability in Systerel S2OPC 1.7.3 allows a remote attacker to cause a denial of service via the LockedStaMac_ProcessMsg_DeleteMonitoredItemsResponse and SOPC_StaMac_NewDeleteMonitoredItems in the client wrapper DeleteMonitoredItems path

PUBLISHED
Date2026-08-05
UPDATED
Date2026-08-05
IMPACT SCORE
NA
EXPLOITABILITY
NA
CVE-2026-67863
SUMMARY

In open62541 1.5.5, a server-side use-after-free exists in the local MonitoredItem callback path. The issue occurs when UA_Subscription_localPublish continues to use the current UA_Notification after a callback invokes UA_Server_deleteMonitoredItem for the current local MonitoredItem. This allows a remote attacker to cause a denial of service.

PUBLISHED
Date2026-08-05
UPDATED
Date2026-08-05
RISK INFORMATION (Score: 7.5)
CVSS3
Base Score: 7.5
Complexity: LOW
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
IMPACT SCORE
3.6
EXPLOITABILITY
3.9
CVE-2026-19026
SUMMARY

H5Z__filter_nbit in H5Znbit.c in HDF5 through 2.3.0 dereferences cd_values[0] through cd_values[4] without validating that cd_values is non-NULL or that cd_nelmts is at least 5, the fixed size of the filter's header. This allows attackers to cause a denial of service via a crafted HDF5 file that stores the N-Bit filter pipeline message with zero client-data values, opened and read via H5Dread, e.g. by the h5ls or h5repack tools.

PUBLISHED
Date2026-08-05
UPDATED
Date2026-08-05
RISK INFORMATION (Score: )
CVSS4
Base Score: 6.8
Complexity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:P/VC:N/VI:N/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
IMPACT SCORE
NA
EXPLOITABILITY
NA
CVE-2026-19025
SUMMARY

H5O__layout_decode in H5Olayout.c in HDF5 through 2.3.0 does not validate that a chunked dataset's stored chunk-layout dimensionality matches its dataspace rank when an existing dataset is opened, whereas this check is performed only at dataset-creation time. This allows attackers to cause a denial of service (divide-by-zero and application crash in H5S__hyper_iter_get_seq_list in src/H5Shyper.c) via a crafted HDF5 file with mismatched chunk/dataspace ranks that is opened and read via H5Dopen2 and H5Dread, e.g. by the h5repack tool.

PUBLISHED
Date2026-08-05
UPDATED
Date2026-08-05
RISK INFORMATION (Score: )
CVSS4
Base Score: 6.8
Complexity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:P/VC:N/VI:N/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
IMPACT SCORE
NA
EXPLOITABILITY
NA