Comparison Overview

SunEdison Semiconductor

VS

TSMC

SunEdison Semiconductor

501 Pearl Drive, None, St. Peters, MO, US, 63376
Last Update: 2025-08-05 (UTC)
Between 750 and 799

SunEdison Semiconductor's silicon wafers are the foundation for intelligent electronics in devices such as computers, smart phones, TVs, gaming devices, music players, appliances, automobiles and many industrial and space applications. We are a global leader in semiconductor technology, providing innovative, advanced technology solutions to leading chip manufacturers focused on transforming the foundation of a connected world. With R&D and manufacturing facilities in the U.S., Europe, and Asia, we focus on innovation throughout our business. As a trusted partner, we serve 100% of the top 25 customers in the semiconductor industry. SunEdison Semiconductor - the foundation of connected world Since 1959

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 679
Subsidiaries: 0
12-month incidents
0
Known data breaches
0
Attack type number
0

TSMC

8, Li-Hsin Rd. 6, Hsinchu Science Park, None, Hsinchu, Taiwan, TW, 300
Last Update: 2025-08-09 (UTC)
Between 800 and 849

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 23,504
Subsidiaries: 0
12-month incidents
1
Known data breaches
2
Attack type number
2

Compliance Badges Comparison

Security & Compliance Standards Overview

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
https://images.rankiteo.com/companyimages/tsmc.jpeg
TSMC
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
Compliance Summary
SunEdison Semiconductor
100%
Compliance Rate
0/4 Standards Verified
TSMC
0%
Compliance Rate
0/4 Standards Verified

Benchmark & Cyber Underwriting Signals

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for SunEdison Semiconductor in 2025.

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

TSMC has 56.25% more incidents than the average of same-industry companies with at least one recorded incident.

Incident History — SunEdison Semiconductor (X = Date, Y = Severity)

SunEdison Semiconductor cyber incidents detection timeline including parent company and subsidiaries

Incident History — TSMC (X = Date, Y = Severity)

TSMC cyber incidents detection timeline including parent company and subsidiaries

Notable Incidents

Last 3 Security & Risk Events by Company

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
Incidents

No Incident

https://images.rankiteo.com/companyimages/tsmc.jpeg
TSMC
Incidents

Date Detected: 8/2025
Type:Breach
Attack Vector: Insider Access
Motivation: Financial Gain, Corporate Espionage
Blog: Blog

Date Detected: 07/2023
Type:Breach
Motivation: Financial gain
Blog: Blog

Date Detected: 05/2023
Type:Data Leak
Attack Vector: Darkweb Leak
Blog: Blog

FAQ

TSMC company demonstrates a stronger AI Cybersecurity Score compared to SunEdison Semiconductor company, reflecting its advanced cybersecurity posture governance and monitoring frameworks.

TSMC company has historically faced a number of disclosed cyber incidents, whereas SunEdison Semiconductor company has not reported any.

In the current year, TSMC company has reported more cyber incidents than SunEdison Semiconductor company.

Neither TSMC company nor SunEdison Semiconductor company has reported experiencing a ransomware attack publicly.

TSMC company has disclosed at least one data breach, while SunEdison Semiconductor company has not reported such incidents publicly.

Neither TSMC company nor SunEdison Semiconductor company has reported experiencing targeted cyberattacks publicly.

Neither SunEdison Semiconductor company nor TSMC company has reported experiencing or disclosing vulnerabilities publicly.

Neither SunEdison Semiconductor nor TSMC holds any compliance certifications.

Neither company holds any compliance certifications.

Neither SunEdison Semiconductor company nor TSMC company has publicly disclosed detailed information about the number of their subsidiaries.

TSMC company employs more people globally than SunEdison Semiconductor company, reflecting its scale as a Semiconductor Manufacturing.

Neither SunEdison Semiconductor nor TSMC holds SOC 2 Type 1 certification.

Neither SunEdison Semiconductor nor TSMC holds SOC 2 Type 2 certification.

Neither SunEdison Semiconductor nor TSMC holds ISO 27001 certification.

Neither SunEdison Semiconductor nor TSMC holds PCI DSS certification.

Neither SunEdison Semiconductor nor TSMC holds HIPAA certification.

Neither SunEdison Semiconductor nor TSMC holds GDPR certification.

Latest Global CVEs (Not Company-Specific)

Description

Deck Mate 1 executes firmware directly from an external EEPROM without verifying authenticity or integrity. An attacker with physical access can replace or reflash the EEPROM to run arbitrary code that persists across reboots. Because this design predates modern secure-boot or signed-update mechanisms, affected systems should be physically protected or retired from service. The vendor has not indicated that firmware updates are available for this legacy model.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2 lacks a verified secure-boot chain and runtime integrity validation for its controller and display modules. Without cryptographic boot verification, an attacker with physical access can modify or replace the bootloader, kernel, or filesystem and gain persistent code execution on reboot. This weakness allows long-term firmware tampering that survives power cycles. The vendor indicates that more recent firmware updates strengthen update-chain integrity and disable physical update ports to mitigate related attack avenues.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2's firmware update mechanism accepts packages without cryptographic signature verification, encrypts them with a single hard-coded AES key shared across devices, and uses a truncated HMAC for integrity validation. Attackers with access to the update interface - typically via the unit's USB update port - can craft or modify firmware packages to execute arbitrary code as root, allowing persistent compromise of the device's integrity and deck randomization process. Physical or on-premises access remains the most likely attack path, though network-exposed or telemetry-enabled deployments could theoretically allow remote exploitation if misconfigured. The vendor confirmed that firmware updates have been issued to correct these update-chain weaknesses and that USB update access has been disabled on affected units.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Uncontrolled Resource Consumption vulnerability in Legion of the Bouncy Castle Inc. Bouncy Castle for Java FIPS bc-fips on All (API modules), Legion of the Bouncy Castle Inc. Bouncy Castle for Java LTS bcprov-lts8on on All (API modules) allows Excessive Allocation. This vulnerability is associated with program files core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCMSIV.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA224NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA3NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHAKENativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA512NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA384NativeDigest.Java. This issue affects Bouncy Castle for Java FIPS: from 2.1.0 through 2.1.1; Bouncy Castle for Java LTS: from 2.73.0 through 2.73.7.

Risk Information
cvss4
Base: 5.9
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:P/PR:N/UI:N/VC:N/VI:N/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:P/AU:N/R:U/V:C/RE:M/U:Amber
Description

Wasmtime is a runtime for WebAssembly. In versions from 38.0.0 to before 38.0.3, the implementation of component-model related host-to-wasm trampolines in Wasmtime contained a bug where it's possible to carefully craft a component, which when called in a specific way, would crash the host with a segfault or assert failure. Wasmtime 38.0.3 has been released and is patched to fix this issue. There are no workarounds.

Risk Information
cvss4
Base: 2.1
Severity: HIGH
CVSS:4.0/AV:N/AC:H/AT:P/PR:L/UI:P/VC:N/VI:N/VA:L/SC:N/SI:N/SA:L/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X