Comparison Overview

SunEdison Semiconductor

VS

Rohm and Haas Electronic Materials

SunEdison Semiconductor

501 Pearl Drive, None, St. Peters, MO, US, 63376
Last Update: 2025-08-05 (UTC)
Between 750 and 799

SunEdison Semiconductor's silicon wafers are the foundation for intelligent electronics in devices such as computers, smart phones, TVs, gaming devices, music players, appliances, automobiles and many industrial and space applications. We are a global leader in semiconductor technology, providing innovative, advanced technology solutions to leading chip manufacturers focused on transforming the foundation of a connected world. With R&D and manufacturing facilities in the U.S., Europe, and Asia, we focus on innovation throughout our business. As a trusted partner, we serve 100% of the top 25 customers in the semiconductor industry. SunEdison Semiconductor - the foundation of connected world Since 1959

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 679
Subsidiaries: 0
12-month incidents
0
Known data breaches
0
Attack type number
0

Rohm and Haas Electronic Materials

Last Update: 2025-03-15 (UTC)
Between 750 and 799

Rohm and Haas is a global pioneer developing innovative technologies and solutions for the specialty materials industry. At Rohm and Haas, we apply a deep understanding of our customers' businesses to deliver the right technology at the right time. We pair creativity with sound knowledge, making it possible for your company to meet ever-changing market demands.

NAICS: 334
NAICS Definition:
Employees: 10,001+
Subsidiaries: 0
12-month incidents
0
Known data breaches
0
Attack type number
0

Compliance Badges Comparison

Security & Compliance Standards Overview

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
https://images.rankiteo.com/companyimages/rohm-and-haas-electronic-materials.jpeg
Rohm and Haas Electronic Materials
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
Compliance Summary
SunEdison Semiconductor
100%
Compliance Rate
0/4 Standards Verified
Rohm and Haas Electronic Materials
0%
Compliance Rate
0/4 Standards Verified

Benchmark & Cyber Underwriting Signals

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for SunEdison Semiconductor in 2025.

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for Rohm and Haas Electronic Materials in 2025.

Incident History — SunEdison Semiconductor (X = Date, Y = Severity)

SunEdison Semiconductor cyber incidents detection timeline including parent company and subsidiaries

Incident History — Rohm and Haas Electronic Materials (X = Date, Y = Severity)

Rohm and Haas Electronic Materials cyber incidents detection timeline including parent company and subsidiaries

Notable Incidents

Last 3 Security & Risk Events by Company

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
Incidents

No Incident

https://images.rankiteo.com/companyimages/rohm-and-haas-electronic-materials.jpeg
Rohm and Haas Electronic Materials
Incidents

No Incident

FAQ

Rohm and Haas Electronic Materials company demonstrates a stronger AI Cybersecurity Score compared to SunEdison Semiconductor company, reflecting its advanced cybersecurity posture governance and monitoring frameworks.

Historically, Rohm and Haas Electronic Materials company has disclosed a higher number of cyber incidents compared to SunEdison Semiconductor company.

In the current year, Rohm and Haas Electronic Materials company and SunEdison Semiconductor company have not reported any cyber incidents.

Neither Rohm and Haas Electronic Materials company nor SunEdison Semiconductor company has reported experiencing a ransomware attack publicly.

Neither Rohm and Haas Electronic Materials company nor SunEdison Semiconductor company has reported experiencing a data breach publicly.

Neither Rohm and Haas Electronic Materials company nor SunEdison Semiconductor company has reported experiencing targeted cyberattacks publicly.

Neither SunEdison Semiconductor company nor Rohm and Haas Electronic Materials company has reported experiencing or disclosing vulnerabilities publicly.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds any compliance certifications.

Neither company holds any compliance certifications.

Neither SunEdison Semiconductor company nor Rohm and Haas Electronic Materials company has publicly disclosed detailed information about the number of their subsidiaries.

SunEdison Semiconductor company employs more people globally than Rohm and Haas Electronic Materials company, reflecting its scale as a Semiconductor Manufacturing.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds SOC 2 Type 1 certification.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds SOC 2 Type 2 certification.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds ISO 27001 certification.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds PCI DSS certification.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds HIPAA certification.

Neither SunEdison Semiconductor nor Rohm and Haas Electronic Materials holds GDPR certification.

Latest Global CVEs (Not Company-Specific)

Description

Deck Mate 1 executes firmware directly from an external EEPROM without verifying authenticity or integrity. An attacker with physical access can replace or reflash the EEPROM to run arbitrary code that persists across reboots. Because this design predates modern secure-boot or signed-update mechanisms, affected systems should be physically protected or retired from service. The vendor has not indicated that firmware updates are available for this legacy model.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2 lacks a verified secure-boot chain and runtime integrity validation for its controller and display modules. Without cryptographic boot verification, an attacker with physical access can modify or replace the bootloader, kernel, or filesystem and gain persistent code execution on reboot. This weakness allows long-term firmware tampering that survives power cycles. The vendor indicates that more recent firmware updates strengthen update-chain integrity and disable physical update ports to mitigate related attack avenues.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2's firmware update mechanism accepts packages without cryptographic signature verification, encrypts them with a single hard-coded AES key shared across devices, and uses a truncated HMAC for integrity validation. Attackers with access to the update interface - typically via the unit's USB update port - can craft or modify firmware packages to execute arbitrary code as root, allowing persistent compromise of the device's integrity and deck randomization process. Physical or on-premises access remains the most likely attack path, though network-exposed or telemetry-enabled deployments could theoretically allow remote exploitation if misconfigured. The vendor confirmed that firmware updates have been issued to correct these update-chain weaknesses and that USB update access has been disabled on affected units.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Uncontrolled Resource Consumption vulnerability in Legion of the Bouncy Castle Inc. Bouncy Castle for Java FIPS bc-fips on All (API modules), Legion of the Bouncy Castle Inc. Bouncy Castle for Java LTS bcprov-lts8on on All (API modules) allows Excessive Allocation. This vulnerability is associated with program files core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCMSIV.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA224NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA3NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHAKENativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA512NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA384NativeDigest.Java. This issue affects Bouncy Castle for Java FIPS: from 2.1.0 through 2.1.1; Bouncy Castle for Java LTS: from 2.73.0 through 2.73.7.

Risk Information
cvss4
Base: 5.9
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:P/PR:N/UI:N/VC:N/VI:N/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:P/AU:N/R:U/V:C/RE:M/U:Amber
Description

Wasmtime is a runtime for WebAssembly. In versions from 38.0.0 to before 38.0.3, the implementation of component-model related host-to-wasm trampolines in Wasmtime contained a bug where it's possible to carefully craft a component, which when called in a specific way, would crash the host with a segfault or assert failure. Wasmtime 38.0.3 has been released and is patched to fix this issue. There are no workarounds.

Risk Information
cvss4
Base: 2.1
Severity: HIGH
CVSS:4.0/AV:N/AC:H/AT:P/PR:L/UI:P/VC:N/VI:N/VA:L/SC:N/SI:N/SA:L/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X