Comparison Overview

SunEdison Semiconductor

VS

Microchip Technology Inc.

SunEdison Semiconductor

501 Pearl Drive, None, St. Peters, MO, US, 63376
Last Update: 2025-08-05 (UTC)
Between 750 and 799

SunEdison Semiconductor's silicon wafers are the foundation for intelligent electronics in devices such as computers, smart phones, TVs, gaming devices, music players, appliances, automobiles and many industrial and space applications. We are a global leader in semiconductor technology, providing innovative, advanced technology solutions to leading chip manufacturers focused on transforming the foundation of a connected world. With R&D and manufacturing facilities in the U.S., Europe, and Asia, we focus on innovation throughout our business. As a trusted partner, we serve 100% of the top 25 customers in the semiconductor industry. SunEdison Semiconductor - the foundation of connected world Since 1959

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 679
Subsidiaries: 0
12-month incidents
0
Known data breaches
0
Attack type number
0

Microchip Technology Inc.

undefined, Chandler, AZ, undefined, US
Last Update: 2025-03-04 (UTC)
Between 600 and 649

Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 17,487
Subsidiaries: 1
12-month incidents
2
Known data breaches
0
Attack type number
1

Compliance Badges Comparison

Security & Compliance Standards Overview

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
https://images.rankiteo.com/companyimages/microchip-technology.jpeg
Microchip Technology Inc.
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
Compliance Summary
SunEdison Semiconductor
100%
Compliance Rate
0/4 Standards Verified
Microchip Technology Inc.
0%
Compliance Rate
0/4 Standards Verified

Benchmark & Cyber Underwriting Signals

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for SunEdison Semiconductor in 2025.

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

Microchip Technology Inc. has 212.5% more incidents than the average of same-industry companies with at least one recorded incident.

Incident History — SunEdison Semiconductor (X = Date, Y = Severity)

SunEdison Semiconductor cyber incidents detection timeline including parent company and subsidiaries

Incident History — Microchip Technology Inc. (X = Date, Y = Severity)

Microchip Technology Inc. cyber incidents detection timeline including parent company and subsidiaries

Notable Incidents

Last 3 Security & Risk Events by Company

https://images.rankiteo.com/companyimages/memc-electronic-materials.jpeg
SunEdison Semiconductor
Incidents

No Incident

https://images.rankiteo.com/companyimages/microchip-technology.jpeg
Microchip Technology Inc.
Incidents

Date Detected: 6/2025
Type:Ransomware
Attack Vector: Email, Telephone
Motivation: Financial gain
Blog: Blog

Date Detected: 6/2025
Type:Ransomware
Attack Vector: Remote Code Execution, Email Phishing, Phone Calls
Motivation: Financial Gain
Blog: Blog

FAQ

SunEdison Semiconductor company demonstrates a stronger AI Cybersecurity Score compared to Microchip Technology Inc. company, reflecting its advanced cybersecurity posture governance and monitoring frameworks.

Microchip Technology Inc. company has historically faced a number of disclosed cyber incidents, whereas SunEdison Semiconductor company has not reported any.

In the current year, Microchip Technology Inc. company has reported more cyber incidents than SunEdison Semiconductor company.

Microchip Technology Inc. company has confirmed experiencing a ransomware attack, while SunEdison Semiconductor company has not reported such incidents publicly.

Neither Microchip Technology Inc. company nor SunEdison Semiconductor company has reported experiencing a data breach publicly.

Neither Microchip Technology Inc. company nor SunEdison Semiconductor company has reported experiencing targeted cyberattacks publicly.

Neither SunEdison Semiconductor company nor Microchip Technology Inc. company has reported experiencing or disclosing vulnerabilities publicly.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds any compliance certifications.

Neither company holds any compliance certifications.

Microchip Technology Inc. company has more subsidiaries worldwide compared to SunEdison Semiconductor company.

Microchip Technology Inc. company employs more people globally than SunEdison Semiconductor company, reflecting its scale as a Semiconductor Manufacturing.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds SOC 2 Type 1 certification.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds SOC 2 Type 2 certification.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds ISO 27001 certification.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds PCI DSS certification.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds HIPAA certification.

Neither SunEdison Semiconductor nor Microchip Technology Inc. holds GDPR certification.

Latest Global CVEs (Not Company-Specific)

Description

Deck Mate 1 executes firmware directly from an external EEPROM without verifying authenticity or integrity. An attacker with physical access can replace or reflash the EEPROM to run arbitrary code that persists across reboots. Because this design predates modern secure-boot or signed-update mechanisms, affected systems should be physically protected or retired from service. The vendor has not indicated that firmware updates are available for this legacy model.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2 lacks a verified secure-boot chain and runtime integrity validation for its controller and display modules. Without cryptographic boot verification, an attacker with physical access can modify or replace the bootloader, kernel, or filesystem and gain persistent code execution on reboot. This weakness allows long-term firmware tampering that survives power cycles. The vendor indicates that more recent firmware updates strengthen update-chain integrity and disable physical update ports to mitigate related attack avenues.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Deck Mate 2's firmware update mechanism accepts packages without cryptographic signature verification, encrypts them with a single hard-coded AES key shared across devices, and uses a truncated HMAC for integrity validation. Attackers with access to the update interface - typically via the unit's USB update port - can craft or modify firmware packages to execute arbitrary code as root, allowing persistent compromise of the device's integrity and deck randomization process. Physical or on-premises access remains the most likely attack path, though network-exposed or telemetry-enabled deployments could theoretically allow remote exploitation if misconfigured. The vendor confirmed that firmware updates have been issued to correct these update-chain weaknesses and that USB update access has been disabled on affected units.

Risk Information
cvss4
Base: 7.0
Severity: LOW
CVSS:4.0/AV:P/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

Uncontrolled Resource Consumption vulnerability in Legion of the Bouncy Castle Inc. Bouncy Castle for Java FIPS bc-fips on All (API modules), Legion of the Bouncy Castle Inc. Bouncy Castle for Java LTS bcprov-lts8on on All (API modules) allows Excessive Allocation. This vulnerability is associated with program files core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/fips/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCFB.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeEngine.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCBC.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeGCMSIV.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCCM.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/engines/AESNativeCTR.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA256NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA224NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA3NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHAKENativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA512NativeDigest.Java, core/src/main/jdk1.9/org/bouncycastle/crypto/digests/SHA384NativeDigest.Java. This issue affects Bouncy Castle for Java FIPS: from 2.1.0 through 2.1.1; Bouncy Castle for Java LTS: from 2.73.0 through 2.73.7.

Risk Information
cvss4
Base: 5.9
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:P/PR:N/UI:N/VC:N/VI:N/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:P/AU:N/R:U/V:C/RE:M/U:Amber
Description

Wasmtime is a runtime for WebAssembly. In versions from 38.0.0 to before 38.0.3, the implementation of component-model related host-to-wasm trampolines in Wasmtime contained a bug where it's possible to carefully craft a component, which when called in a specific way, would crash the host with a segfault or assert failure. Wasmtime 38.0.3 has been released and is patched to fix this issue. There are no workarounds.

Risk Information
cvss4
Base: 2.1
Severity: HIGH
CVSS:4.0/AV:N/AC:H/AT:P/PR:L/UI:P/VC:N/VI:N/VA:L/SC:N/SI:N/SA:L/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X